Eleco Software, the developer of professional 3D ArCon Architect Software, has appointed Sheffield-based Uber for the packaging design brief for its new products. Uber has been tasked to create and ...

Global food product manufacturer Mars Inc. is partnering with Pittsburgh-based engineering software company Ansys in which Mars will adopt simulation software that could “reimagine” its packaging ...

LONDON--(BUSINESS WIRE)-- nVent Electric plc (NYSE:NVT) (“nVent”), a global leader in electrical connection and protection solutions, today introduced the newest features for nVent RAYCHEM TracerLynx ...

As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.