Abstract: This letter proposes a method for rapid analysis of the scattering characteristics of large-scale arrays based on the regional decomposition strategy. To achieve array analysis, traditional ...
Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...
As air pollution continues to choke Delhi-NCR, with residents struggling to breathe, an innovative initiative in Sector 48, Gurgaon, is drawing attention. The society is using ‘artificial rain’ to ...
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